Adhesives Technology for Electronic Applications

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This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such a...
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This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such a...
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  • Formats: pdf
  • ISBN: 9780080947167
  • Publication Date: 15 Jan 2013
  • Publisher: Elsevier Science
  • Product language: English
  • Drm Setting: DRM