Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

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This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions. The fracture behavior of Pb-free joint interfaces inducedby stress, deformation of solder and substrate are shown, the shear fracturestrength of the Cu6Sn5 IMC is measured experimentally for the first time, andthe...

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This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions. The fracture behavior of Pb-free joint interfaces inducedby stress, deformation of solder and substrate are shown, the shear fracturestrength of the Cu6Sn5 IMC is measured experimentally for the first time, andthe...

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  • Formats: pdf
  • ISBN: 9783662488232
  • Publication Date: 31 Oct 2015
  • Publisher: Springer Berlin Heidelberg
  • Product language: English
  • Drm Setting: DRM