Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection

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Division on Engineering and Physical SciencesDivision on Engineering and Physical Sciences, National Research Council, Commission on Engineering and Technical Systems, National Materials Advisory Board, Committee on Materials for High-Density Electronic Packaging
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  • Formats: pdf
  • ISBN: 9780309536691
  • Publication Date: 1 Jan 1990
  • Publisher: National Academies Press
  • Product language: English
  • Drm Setting: DRM