Modeling and Simulation for Microelectronic Packaging Assembly

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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production...
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product_type_E-book
epub
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109.95 £
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production...
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  • Formats: epub
  • ISBN: 9780470828410
  • Publication Date: 24 Aug 2011
  • Publisher: Wiley
  • Product language: English
  • Drm Setting: DRM