New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore''s Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (<300K) to these innovatively configured device structures can enable the industry professionals to keep up with Moore''s Law-...