Recent Trends in VLSI and Semiconductor Packaging
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The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("e;SMART-2024"e;) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "e;SMART-2024"e; seek...
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The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("e;SMART-2024"e;) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "e;SMART-2024"e; seek...
Read more