Self-Organized 3D Integrated Optical Interconnects

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Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technolog...

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Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technolog...

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  • Formats: pdf
  • ISBN: 9781000064605
  • Publication Date: 8 Mar 2021
  • Publisher: Jenny Stanford Publishing
  • Product language: English
  • Drm Setting: DRM