Solder Joint Reliability Prediction for Multiple Environments

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be ...

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product_type_E-book
pdf
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89.50 £

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be ...

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  • Formats: pdf
  • ISBN: 9780387793948
  • Publication Date: 16 Dec 2008
  • Publisher: Springer US
  • Product language: English
  • Drm Setting: DRM