Follow the Author
Lau, John H.
Lau, John H.
E-books
Reference, Information and Interdisciplinary subjects
Interdisciplinary studies
History and Archaeology
History
Mathematics and Science
Physics
Materials / States of matter
Condensed matter physics (liquid state and solid state physics)
Optical physics

Author's Books

E-book
Solid * State Magnetism
Lau, John H.Lau, John H.
Price
44.99 £ * Old Price 179.50 £
E-book
Fan-Out Wafer-Level Packaging
Lau, John H.Lau, John H.
Price
99.50 £
E-book
Heterogeneous Integrations
Lau, John H.Lau, John H.
Price
139.50 £
E-book
Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-ChengLee, Ning-Cheng
Price
99.50 £
E-book
Semiconductor Advanced Packaging
Lau, John H.Lau, John H.
Price
99.50 £
E-book
Fan-Out Wafer-Level Packaging
Lau, John H.Lau, John H.
Price
99.50 £
E-book
Semiconductor Advanced Packaging
Lau, John H.Lau, John H.
Price
99.50 £
E-book
Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-ChengLee, Ning-Cheng
Price
99.50 £
E-book
Heterogeneous Integrations
Lau, John H.Lau, John H.
Price
139.50 £
E-book
Through-Silicon Vias for 3D Integration
Lau, John H.Lau, John H.
Price
145.80 £
E-book
3D IC Integration and Packaging
Lau, John H.Lau, John H.
Price
196.20 £
E-book
Microvias: For Low Cost, High Density Interconnects
Lee, Ricky S. W.Lee, Ricky S. W.
Price
89.96 £
E-book
Electronics Manufacturing
Lee, Ricky S. W.Lee, Ricky S. W.
Price
135.00 £
E-book
Advanced MEMS Packaging
Aibin, YuAibin, Yu
Price
161.10 £
E-book
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Lau, John H.Lau, John H.
Price
131.40 £
E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.Lau, John H.
Price
149.99 £
E-book
Advanced MEMS Packaging
Aibin, YuAibin, Yu
Price
161.10 £
E-book
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.Lau, John H.
Price
109.50 £
E-book
Through-Silicon Vias for 3D Integration
Lau, John H.Lau, John H.
Price
145.80 £
E-book
3D IC Integration and Packaging
Lau, John H.Lau, John H.
Price
196.20 £
E-book
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Lau, John H.Lau, John H.
Price
131.40 £
E-book
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.Lau, John H.
Price
109.50 £
E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.Lau, John H.
Price
149.99 £