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Lau, John H.
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Lau, John H.
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E-books
History and Archaeology
History
Mathematics and Science
Physics
Materials / States of matter
Condensed matter physics (liquid state and solid state physics)
Optical physics
Technology, Engineering, Agriculture, Industrial processes
Technology: general issues
Lau, John H.
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E-books
History and Archaeology
History
Mathematics and Science
Physics
Materials / States of matter
Condensed matter physics (liquid state and solid state physics)
Optical physics
Technology, Engineering, Agriculture, Industrial processes
Technology: general issues
E-book
3D IC Integration and Packaging
Lau, John H.
Price
0
196.20 £
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E-book
3D IC Integration and Packaging
Lau, John H.
0
0
Price
196.20 £
E-book
Microvias: For Low Cost, High Density Interconnects
Lee, Ricky S. W.
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0
89.96 £
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Microvias: For Low Cost, High Density Interco...
Lee, Ricky S. W.
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0
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89.96 £
E-book
Electronics Manufacturing
Lee, Ricky S. W.
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0
135.00 £
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E-book
Electronics Manufacturing
Lee, Ricky S. W.
0
0
Price
135.00 £
E-book
Advanced MEMS Packaging
Aibin, Yu
Price
0
161.10 £
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E-book
Advanced MEMS Packaging
Aibin, Yu
0
0
Price
161.10 £
E-book
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Lau, John H.
Price
0
131.40 £
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E-book
Reliability of RoHS-Compliant 2D and 3D IC In...
Lau, John H.
0
0
Price
131.40 £
E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
Price
0
145.80 £
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E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
0
0
Price
145.80 £
E-book
Solder Joint Reliability
Lau, John H.
Price
0
179.50 £
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E-book
Solder Joint Reliability
Lau, John H.
0
0
Price
179.50 £
E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
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0
99.50 £
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E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
0
0
Price
99.50 £
E-book
Heterogeneous Integrations
Lau, John H.
Price
0
139.50 £
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E-book
Heterogeneous Integrations
Lau, John H.
0
0
Price
139.50 £
E-book
Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-Cheng
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0
99.50 £
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E-book
Assembly and Reliability of Lead-Free Solder ...
Lee, Ning-Cheng
0
0
Price
99.50 £
E-book
Semiconductor Advanced Packaging
Lau, John H.
Price
0
99.50 £
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E-book
Semiconductor Advanced Packaging
Lau, John H.
0
0
Price
99.50 £
E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
Price
0
99.50 £
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E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
0
0
Price
99.50 £
E-book
Advanced MEMS Packaging
Aibin, Yu
Price
0
161.10 £
Add to cart
E-book
Advanced MEMS Packaging
Aibin, Yu
0
0
Price
161.10 £
E-book
Semiconductor Advanced Packaging
Lau, John H.
Price
0
99.50 £
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E-book
Semiconductor Advanced Packaging
Lau, John H.
0
0
Price
99.50 £
E-book
Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-Cheng
Price
0
99.50 £
Add to cart
E-book
Assembly and Reliability of Lead-Free Solder ...
Lee, Ning-Cheng
0
0
Price
99.50 £
E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
Price
0
145.80 £
Add to cart
E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
0
0
Price
145.80 £
E-book
Heterogeneous Integrations
Lau, John H.
Price
0
139.50 £
Add to cart
E-book
Heterogeneous Integrations
Lau, John H.
0
0
Price
139.50 £
E-book
3D IC Integration and Packaging
Lau, John H.
Price
0
196.20 £
Add to cart
E-book
3D IC Integration and Packaging
Lau, John H.
0
0
Price
196.20 £
E-book
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Lau, John H.
Price
0
131.40 £
Add to cart
E-book
Reliability of RoHS-Compliant 2D and 3D IC In...
Lau, John H.
0
0
Price
131.40 £
E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.
Price
0
149.99 £
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E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Ou...
Lau, John H.
0
0
Price
149.99 £
E-book
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Price
0
109.50 £
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E-book
Chiplet Design and Heterogeneous Integration ...
Lau, John H.
0
0
Price
109.50 £
E-book
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Price
0
109.50 £
Add to cart
E-book
Chiplet Design and Heterogeneous Integration ...
Lau, John H.
0
0
Price
109.50 £
E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.
Price
0
149.99 £
Add to cart
E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Ou...
Lau, John H.
0
0
Price
149.99 £
