E-books
Audiobooks
E-books
Audiobooks
Hello!
Personal Area
Wishlist
Orders
Compare list
Login
E-books
Audiobooks
About us
Support
|
Lau, John H.
Follow the Author
Lau, John H.
Follow
E-books
Reference, Information and Interdisciplinary subjects
Interdisciplinary studies
Mathematics and Science
Physics
Materials / States of matter
Condensed matter physics (liquid state and solid state physics)
Optical physics
Electricity, electromagnetism and magnetism
Technology, Engineering, Agriculture, Industrial processes
Lau, John H.
Author's Books
Sorting
Sorting collapsed
Beste Treffer
Titel: A-Z
Titel: Z-A
Preis aufsteigend
Preis absteigend
Erscheinungsdatum: aufsteigend
Erscheinungsdatum: absteigend
Sorting
Beste Treffer
Titel: A-Z
Titel: Z-A
Preis aufsteigend
Preis absteigend
Erscheinungsdatum: aufsteigend
Erscheinungsdatum: absteigend
E-books
Reference, Information and Interdisciplinary subjects
Interdisciplinary studies
Mathematics and Science
Physics
Materials / States of matter
Condensed matter physics (liquid state and solid state physics)
Optical physics
Electricity, electromagnetism and magnetism
Technology, Engineering, Agriculture, Industrial processes
product_type_E-book
Solid * State Magnetism
Lau, John H.
Price
44.99 £ *
Old Price
179.50 £
Add to cart
product_type_E-book
Solid * State Magnetism
Lau, John H.
0
0
Price
44.99 £ *
Old Price
179.50 £
product_type_E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
Price
0
99.50 £
Add to cart
product_type_E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
0
0
Price
99.50 £
product_type_E-book
Heterogeneous Integrations
Lau, John H.
Price
0
139.50 £
Add to cart
product_type_E-book
Heterogeneous Integrations
Lau, John H.
0
0
Price
139.50 £
product_type_E-book
Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-Cheng
Price
0
99.50 £
Add to cart
product_type_E-book
Assembly and Reliability of Lead-Free Solder ...
Lee, Ning-Cheng
0
0
Price
99.50 £
product_type_E-book
Semiconductor Advanced Packaging
Lau, John H.
Price
0
99.50 £
Add to cart
product_type_E-book
Semiconductor Advanced Packaging
Lau, John H.
0
0
Price
99.50 £
product_type_E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
Price
0
99.50 £
Add to cart
product_type_E-book
Fan-Out Wafer-Level Packaging
Lau, John H.
0
0
Price
99.50 £
product_type_E-book
Semiconductor Advanced Packaging
Lau, John H.
Price
0
99.50 £
Add to cart
product_type_E-book
Semiconductor Advanced Packaging
Lau, John H.
0
0
Price
99.50 £
product_type_E-book
Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-Cheng
Price
0
99.50 £
Add to cart
product_type_E-book
Assembly and Reliability of Lead-Free Solder ...
Lee, Ning-Cheng
0
0
Price
99.50 £
product_type_E-book
Heterogeneous Integrations
Lau, John H.
Price
0
139.50 £
Add to cart
product_type_E-book
Heterogeneous Integrations
Lau, John H.
0
0
Price
139.50 £
product_type_E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
Price
0
145.80 £
Add to cart
product_type_E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
0
0
Price
145.80 £
product_type_E-book
3D IC Integration and Packaging
Lau, John H.
Price
0
196.20 £
Add to cart
product_type_E-book
3D IC Integration and Packaging
Lau, John H.
0
0
Price
196.20 £
product_type_E-book
Microvias: For Low Cost, High Density Interconnects
Lee, Ricky S. W.
Price
0
89.96 £
Add to cart
product_type_E-book
Microvias: For Low Cost, High Density Interco...
Lee, Ricky S. W.
0
0
Price
89.96 £
product_type_E-book
Electronics Manufacturing
Lee, Ricky S. W.
Price
0
135.00 £
Add to cart
product_type_E-book
Electronics Manufacturing
Lee, Ricky S. W.
0
0
Price
135.00 £
product_type_E-book
Advanced MEMS Packaging
Aibin, Yu
Price
0
161.10 £
Add to cart
product_type_E-book
Advanced MEMS Packaging
Aibin, Yu
0
0
Price
161.10 £
product_type_E-book
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Lau, John H.
Price
0
131.40 £
Add to cart
product_type_E-book
Reliability of RoHS-Compliant 2D and 3D IC In...
Lau, John H.
0
0
Price
131.40 £
product_type_E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.
Price
0
149.99 £
Add to cart
product_type_E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Ou...
Lau, John H.
0
0
Price
149.99 £
product_type_E-book
Advanced MEMS Packaging
Aibin, Yu
Price
0
161.10 £
Add to cart
product_type_E-book
Advanced MEMS Packaging
Aibin, Yu
0
0
Price
161.10 £
product_type_E-book
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Price
0
109.50 £
Add to cart
product_type_E-book
Chiplet Design and Heterogeneous Integration ...
Lau, John H.
0
0
Price
109.50 £
product_type_E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
Price
0
145.80 £
Add to cart
product_type_E-book
Through-Silicon Vias for 3D Integration
Lau, John H.
0
0
Price
145.80 £
product_type_E-book
3D IC Integration and Packaging
Lau, John H.
Price
0
196.20 £
Add to cart
product_type_E-book
3D IC Integration and Packaging
Lau, John H.
0
0
Price
196.20 £
product_type_E-book
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Lau, John H.
Price
0
131.40 £
Add to cart
product_type_E-book
Reliability of RoHS-Compliant 2D and 3D IC In...
Lau, John H.
0
0
Price
131.40 £
product_type_E-book
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Price
0
109.50 £
Add to cart
product_type_E-book
Chiplet Design and Heterogeneous Integration ...
Lau, John H.
0
0
Price
109.50 £
product_type_E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.
Price
0
149.99 £
Add to cart
product_type_E-book
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Ou...
Lau, John H.
0
0
Price
149.99 £