Author's Books

Solid * State Magnetism
product_type_E-book
Solid * State Magnetism
Price
44.99 £ * Old Price 179.50 £
Fan-Out Wafer-Level Packaging
product_type_E-book
Fan-Out Wafer-Level Packaging
Price
0
99.50 £
Heterogeneous Integrations
product_type_E-book
Heterogeneous Integrations
Price
0
139.50 £
Semiconductor Advanced Packaging
product_type_E-book
Semiconductor Advanced Packaging
Price
0
99.50 £
Fan-Out Wafer-Level Packaging
product_type_E-book
Fan-Out Wafer-Level Packaging
Price
0
99.50 £
Semiconductor Advanced Packaging
product_type_E-book
Semiconductor Advanced Packaging
Price
0
99.50 £
Heterogeneous Integrations
product_type_E-book
Heterogeneous Integrations
Price
0
139.50 £
Through-Silicon Vias for 3D Integration
product_type_E-book
Through-Silicon Vias for 3D Integration
Price
0
145.80 £
3D IC Integration and Packaging
product_type_E-book
3D IC Integration and Packaging
Price
0
196.20 £
Electronics Manufacturing
product_type_E-book
Electronics Manufacturing
Price
0
135.00 £
Advanced MEMS Packaging
product_type_E-book
Advanced MEMS Packaging
Price
0
161.10 £
Advanced MEMS Packaging
product_type_E-book
Advanced MEMS Packaging
Price
0
161.10 £
Through-Silicon Vias for 3D Integration
product_type_E-book
Through-Silicon Vias for 3D Integration
Price
0
145.80 £
3D IC Integration and Packaging
product_type_E-book
3D IC Integration and Packaging
Price
0
196.20 £