Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

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Lau, John H.Lau, John H.

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, t...

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pdf
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99.50 £
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epub
Price
99.50 £

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, t...

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  • Formats: pdf
  • ISBN: 9789811088841
  • Publication Date: 5 Apr 2018
  • Publisher: Springer Nature Singapore
  • Product language: English
  • Drm Setting: DRM