Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
This book presents the proceedings of the 7th IFToMM Asian Mechanisms and Machine Science Conference (Asian MMS), held in Almaty, Kazakhstan, on August 28-30, 2024.
This book is a collection of papers presented at the International Conference on Renewable Power (ICRP 2020), held during 13-14 July 2020 in Rajouri, Jammu, India.
This book provides a comprehensive overview of signal filtering, including an introduction, definitions of the terms and algorithms for numerical calculation of the properties of the transfer function in frequency and time domains.
This book covers the recent research advancements in the area of charging strategies that can be employed to accommodate the anticipated high deployment of Plug-in Electric Vehicles (PEVs) in smart grids.
This book focuses on the state of the art in worldwide research on applying optimization approaches to intelligently control charging and discharging of batteries of Plug-in Electric Vehicles (PEVs) in smart grids.
A static compensator (STATCOM), also known as static synchronous compensator, is a member of the flexible alternating current transmission system (FACTS) devices.
This book provides readers a complete and self-contained set of knowledge about dependent source separation, including the latest development in this field.
This book introduces a family of large-signal stability-based control methods for different power inverters (grid-connected inverter, standalone inverter, single-phase inverter, and three-phase inverter) in practical applications.
The textbook discusses design and analysis of microwave high power and high efficiency amplifiers for communications, appropriate for undergraduate, post-graduate students, practical circuit designers and researchers in the field of electronics and communication engineering.
This book presents theoretical foundations and technical implementation guidelines for multi-vehicle fleet maneuvering, which can be implemented by readers and can also be a basis for future research.
The book discusses a broad overview of traditional machine learning methods and state-of-the-art deep learning practices for hardware security applications, in particular the techniques of launching potent "e;modeling attacks"e; on Physically Unclonable Function (PUF) circuits, which are promising hardware security primitives.
This book brings together papers presented at the 3rd International Conference on Artificial Intelligence in China (ChinaAI), which provides a venue to disseminate the latest developments and to discuss the interactions and links between these multidisciplinary fields.
This book covers evolution, concept and applications of modern semiconductor devices such as tunnel field effect transistors (TFETs), vertical super-thin body MOSFETs, ion sensing FETs (ISFETs), non-conventional solar cells, opto-electro mechanical devices and thin film transistors (TFTs).
This book presents selected articles from INDIA SMART UTILTY WEEK (ISUW 2021), which is the seventh edition of the Conference cum Exhibition on Smart Grids and Smart Cities, organized by India Smart Grid Forum from 02-05 March 2021, in New Delhi, India.
The book systematically introduces the design theory and method of multi-band RF filtering circuits for the modern wireless communication systems or radar systems, which are required to operate at multi-bands.
This book investigates the control and optimization of grid-tied power converters, with a special attention attached to pulse width modulation, which determines the size and cost of power converters as well as switching harmonics.
This book includes original, peer-reviewed research papers from the 2021 International Top-Level Forum on Engineering Science and Technology Development Strategy -- the 6th PURPLE MOUNTAIN FORUM on Smart Grid Protection and Control (PMF2021), held in Nanjing, China, on August 14-22, 2021.
This book is a collection of selected high-quality research papers presented at the International Conference on Industrial Instrumentation and Control (ICI2C 2021), organized by the Department of Applied Electronics & Instrumentation Engineering, RCC Institute of Information Technology, Kolkata, India, during 20-August 22, 2021.
This book is a collection of papers presented at XIV International Scientific Conference "e;INTERAGROMASH 2021"e;, held at Don State Technical University, Rostov-on-Don, Russia, during 24-26 February 2021.
This book presents a collection of peer-reviewed articles from the 7th International Conference on Microelectronics, Circuits, and Systems - Micro 2020.
This book presents selected articles from INDIA SMART UTILTY WEEK (ISUW 2019), which is the fifth edition of the Conference cum Exhibition on Smart Grids and Smart Cities, organized by India Smart Grid Forum from 12-16 March 2019 at Manekshaw Centre, New Delhi, India.
This book includes original, peer-reviewed research papers from the 2020 International Top-Level Forum on Engineering Science and Technology Development Strategy -- the 5th PURPLE MOUNTAIN FORUM on Smart Grid Protection and Control(PMF2020), held in Nanjing, China, on August 15-16, 2020.
This book brings together papers presented at The 2nd International Conference on Artificial Intelligence in China (ChinaAI) 2020, which provides a venue to disseminate the latest developments and to discuss the interactions and links between these multidisciplinary fields.
This book presents the select proceedings of the International Conference on Automation, Signal Processing, Instrumentation and Control (i-CASIC) 2020.
This book presents a novel methodology for the computation of RCS of metallic structures using a parallelized version of NEC in conjunction with a finite element preprocessor which has been strategically incorporated for simplifying geometry modelling catering to NEC guidelines.
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.