Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation.
This book provides a comprehensive presentation of the most advanced research results and technological developments enabling understanding, qualifying and mitigating the soft errors effect in advanced electronics, including the fundamental physical mechanisms of radiation induced soft errors, the various steps that lead to a system failure, the modelling and simulation of soft error at various levels (including physical, electrical, netlist, event driven, RTL, and system level modelling and simulation), hardware fault injection, accelerated radiation testing and natural environment testing, soft error oriented test structures, process-level, device-level, cell-level, circuit-level, architectural-level, software level and system level soft error mitigation techniques.
In recent years, both Networks-on-Chip, as an architectural solution for high-speed interconnect, and power consumption, as a key design constraint, have continued to gain interest in the design and research communities.
Telecommunications is a major global industry, and this unique book chronicles the development of this complex technology from the electric telegraph to the Internet in a simple, accessible, and entertaining way.
This book will describe ultra low-power, integrated circuits and systems designed for the emerging field of neural signal recording and processing, and wireless communication.
This book covers the practical application of dependable electronic systems in real industry, such as space, train control and automotive control systems, and network servers/routers.
This Book and Simulation Software Bundle Project Dear Reader, this book project brings to you a unique study tool for ESD protection solutions used in analog-integrated circuit (IC) design.
Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well.
In many practical applications we deal with a wide class of dynamical systems that are comprised of a family of continuous-time or discrete-time subsystems and a rule orchestrating the switching between the subsystems.
The Information and communication technology (ICT) industry is said to account for 2% of the worldwide carbon emissions - a fraction that continues to grow with the relentless push for more and more sophisticated computing equipment, c- munications infrastructure, and mobile devices.
In August of 2006, an engineering VP from one of Altera's customers approached Misha Burich, VP of Engineering at Altera, asking for help in reliably being able to predict the cost, schedule and quality of system designs reliant on FPGA designs.
High-Speed DSP and Analog System Design is based on the author's over 25 years of experience in high-speed DSP and computer systems and courses in both digital and analog systems design at Rice University.
This book is intended to give a general overview of reliability, faults, fault models, nanotechnology, nanodevices, fault-tolerant architectures and reliability evaluation techniques.
More and more information, audio and video but also a range of other information type, is generated, processed and used by machines today, even though the end user may be a human.
The application of circuits and systems and engineering principles to problems in the medicine has led to the emergence of biomedical circuits and systems as an exciting and rapidly growing area of research.
Biosensors: From Electric Circuits to Immunosensors discusses underlying circuitry of sensors for biomedical and biological engineers as well as biomedical sensing modalities for electrical engineers while providing an applications-based approach to the study of biosensors with over 13 extensive, hands-on labs.
MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena.
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
Current multimedia and telecom applications require complex, heterogeneous multiprocessor system on chip (MPSoC) architectures with specific communication infrastructure in order to achieve the required performance.
Fundamentals of III-V Semiconductor MOSFETs presents the fundamentals and current status of research of compound semiconductor metal-oxide-semiconductor field-effect transistors (MOSFETs) that are envisioned as a future replacement of silicon in digital circuits.
Microprocessors increasingly control and monitor our most critical systems, including automobiles, airliners, medical systems, transportation grids, and defense systems.
Although security is prevalent in PCs, wireless communications and other systems today, it is expected to become increasingly important and widespread in many embedded devices.
This book arises from experience the authors have gained from years of work as industry practitioners in the field of Electronic System Level design (ESL).
A smart camera is an integrated machine vision system which, in addition to image capture circuitry, includes a processor, which can extract information from images without need for an external processing unit, and interface devices used to make results available to other devices.
