Quality, Warranty and Preventive Maintenance examines the impact of product quality on warranty and maintenance costs and strategies, from the perspectives of both manufacturers and users.
Low-Power CMOS Wireless Communications: A Wideband CDMA System Design focuses on the issues behind the development of a high-bandwidth, silicon complementary metal-oxide silicon (CMOS) low-power transceiver system for mobile RF wireless data communications.
Group Technology and Cellular Manufacturing (GT/CM) have been widely-researched areas in the past 15 years and much progress has been made in all branches of GT/CM.
Quality-Oriented Design of Business Processes introduces a modeling method, `Integrated Enterprise Modelling' (IEM), which is related to ISO standards and provides manufacturing organizations with the means of analyzing, improving, and redesigning their business processes.
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Petri Net Synthesis for Discrete Event Control of Manufacturing Systems develops two essential resource-sharing concepts: parallel and sequential mutual exclusions and theoretical results in Petri synthesis.
In the First Edition of this classic text, Roger Haines devised a simple building-block method which enabled students to quickly learn about the operating principles and applications of all the basic devices and subsystems used in HVAC control.
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices.
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology.
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board.
o Computer Automation in Manufacturing provide instruction in computer architecture, interfacing to mechanical systems, and software development for continuous control and discrete event systems.
The current marketplace is undergoing an accelerated pace of change that challenges corporations to innovate new techniques to respond rapidly to an ever-changing environment.
The term rapid prototyping (RP) refers to a generic group of emerging technologies that enable very quick fabrication of engineering components primarily targeted for prototyping applications.
Microelectronic packaging has been recognized as an important "e;enabler"e; for the solid- state revolution in electronics which we have witnessed in the last third of the twentieth century.
Over the past several decades, consumer interest in the fine vintage wines produced by small "e;boutique"e; vintners across the United States has grown to rival that of many European estates.
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.
Analysis and Modeling of Manufacturing Systems is a set of papers on some of the newest research and applications of mathematical and computational techniques to manufacturing systems and supply chains.
ESD Design and Analysis Handbook presents an overview of ESD as it effects electronic circuits and provides a concise introduction for students, engineers, circuit designers and failure analysts.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(R) describes the method in great detail starting from the theoretical basis.
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
Completely re-written with two new co-authors who provide expertise in physical chemistry and engineering, the Sixth Edition of this textbook/reference explores the entire scope of the ice cream industry, from the chemical, physical, engineering and biological principles of the production process, to the marketing and distribution of the finished product.
Integrated Design of a Product Family and Its Assembly System presents an integrated approach for the design of a product family and its assembly system, whose main principles consider the product family as a fictitious unique product for which the assembly system is to be devised.
Advances in Product Family and Product Platform Design: Methods & Applications highlights recent advances that have been made to support product family and product platform design along with successful applications in industry.
Evaluating Production Efficiency in China examines production from engineering and statistics perspectives rather than from economics and mathematics perspectives.
Essentials of Water Systems Design in the Oil, Gas and Chemical Processing Industries provides valuable insight for decision makers by outlining key technical considerations and requirements of four critical systems in industrial processing plants-water treatment systems, raw water and plant water systems, cooling water distribution and return systems, and fire water distribution and storage facilities.
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.
Innovative Management in Information and Production is based on the proceedings of the Third International Symposium on Innovative Management, Information and Production.
This book presents selected, peer-reviewed proceedings of the 3rd International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022), held in the city of Can Tho, Vietnam, from 10 to 13 November 2022.
This book describes thermal plant simulation, that is, dynamic simulation of plants which produce, exchange and otherwise utilize heat as their working medium.
Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 2 represents one of seven volumes of technical papers presented at the Society for Experimental Mechanics SEM 12th International Congress & Exposition on Experimental and Applied Mechanics, held at Costa Mesa, California, June 11-14, 2012.
High Performance Grinding and Advanced Cutting Tools discusses the fundamentals and advances in high performance grinding processes, and provides a complete overview of newly-developing areas in the field.
Environment-Friendly Machining provides an in-depth overview of environmentally-friendly machining processes, covering numerous different types of machining in order to identify which practice is the most environmentally sustainable.
