Pierce helps you take control of the dizzying process of effecting changing procedures, processes, and attitudes in your company's safety and health program and then position your operations for continuous improvement.
Solid Freeform Fabrication is a set of manufacturing processes that are capable of producing complex freeform solid objects directly from a computer model of an object without part-specific tooling or knowledge.
This single source reference offers a pragmatic and accessible approach to the basic methods and procedures used in the manufacturing and design of modern electronic products.
Those of us who grew up in the "e;through-hole"e; age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
The importance of proper geometric dimensioning and tolerancing as a means of expressing the designer's functional intent and controlling the inevitable geometric and dimensional variations of mechanical parts and assemblies, is becoming well recognized.
Progress in optical fiber sensors The field of optical fiber sensor technology is one that continues to expand and develop at a rate that could barely have been predicted a few years ago.
Quality, Warranty and Preventive Maintenance examines the impact of product quality on warranty and maintenance costs and strategies, from the perspectives of both manufacturers and users.
Low-Power CMOS Wireless Communications: A Wideband CDMA System Design focuses on the issues behind the development of a high-bandwidth, silicon complementary metal-oxide silicon (CMOS) low-power transceiver system for mobile RF wireless data communications.
Group Technology and Cellular Manufacturing (GT/CM) have been widely-researched areas in the past 15 years and much progress has been made in all branches of GT/CM.
Quality-Oriented Design of Business Processes introduces a modeling method, `Integrated Enterprise Modelling' (IEM), which is related to ISO standards and provides manufacturing organizations with the means of analyzing, improving, and redesigning their business processes.
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Petri Net Synthesis for Discrete Event Control of Manufacturing Systems develops two essential resource-sharing concepts: parallel and sequential mutual exclusions and theoretical results in Petri synthesis.
In the First Edition of this classic text, Roger Haines devised a simple building-block method which enabled students to quickly learn about the operating principles and applications of all the basic devices and subsystems used in HVAC control.
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices.
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology.
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board.
o Computer Automation in Manufacturing provide instruction in computer architecture, interfacing to mechanical systems, and software development for continuous control and discrete event systems.
The current marketplace is undergoing an accelerated pace of change that challenges corporations to innovate new techniques to respond rapidly to an ever-changing environment.
The term rapid prototyping (RP) refers to a generic group of emerging technologies that enable very quick fabrication of engineering components primarily targeted for prototyping applications.
Microelectronic packaging has been recognized as an important "e;enabler"e; for the solid- state revolution in electronics which we have witnessed in the last third of the twentieth century.
Over the past several decades, consumer interest in the fine vintage wines produced by small "e;boutique"e; vintners across the United States has grown to rival that of many European estates.
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.
ESD Design and Analysis Handbook presents an overview of ESD as it effects electronic circuits and provides a concise introduction for students, engineers, circuit designers and failure analysts.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(R) describes the method in great detail starting from the theoretical basis.
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
Completely re-written with two new co-authors who provide expertise in physical chemistry and engineering, the Sixth Edition of this textbook/reference explores the entire scope of the ice cream industry, from the chemical, physical, engineering and biological principles of the production process, to the marketing and distribution of the finished product.
Integrated Design of a Product Family and Its Assembly System presents an integrated approach for the design of a product family and its assembly system, whose main principles consider the product family as a fictitious unique product for which the assembly system is to be devised.
Advances in Product Family and Product Platform Design: Methods & Applications highlights recent advances that have been made to support product family and product platform design along with successful applications in industry.
Evaluating Production Efficiency in China examines production from engineering and statistics perspectives rather than from economics and mathematics perspectives.
